The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2025
Filed:
Jul. 28, 2023
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Yu-Sheng Lin, Zhubei, TW;
Po-Yao Lin, Hsinchu County, TW;
Shu-Shen Yeh, Taoyuan, TW;
Chin-Hua Wang, New Taipei, TW;
Shin-Puu Jeng, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A chip package structure is provided. The chip package structure includes a wiring substrate. The chip package structure includes a chip package over the wiring substrate. The chip package structure includes a first heat conductive structure over the chip package. The chip package structure includes a ring dam over the chip package and surrounding the first heat conductive structure. The ring dam has a gap. The chip package structure includes a heat dissipation lid over the first heat conductive structure and the ring dam.