The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2025
Filed:
Aug. 10, 2022
Applicant:
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Inventors:
Po-Yao Lin, Zhudong Township, TW;
Sheng-Liang Kuo, Hsinchu, TW;
Yu-Sheng Lin, Zhubei, TW;
Kathy Yan, Hsinchu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/427 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
H01L 23/427 (2013.01); H01L 23/473 (2013.01);
Abstract
A thermal module may include a cold plate including a cold plate base having a cold plate base protruding portion, and a cold plate cover on the cold plate base, and a heat pipe between the cold plate base and the cold plate cover, and including an upper heat pipe portion and a lower heat pipe portion in the cold plate base protruding portion.