Sheng-Liang Kuo

Title: Innovations of Sheng-Liang Kuo in Semiconductor Technology

Introduction

Sheng-Liang Kuo is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the development of thermal modules. His innovative work has led to the filing of a patent that addresses critical aspects of semiconductor packaging.

Latest Patents

One of Sheng-Liang Kuo's key patents is titled "Thermal module for a semiconductor package and methods of forming the same." This patent describes a thermal module that includes a cold plate with a base and cover, along with a heat pipe situated between them. The design features an upper and lower heat pipe portion, enhancing the efficiency of heat dissipation in semiconductor packages. This invention is crucial for improving the performance and reliability of semiconductor devices.

Career Highlights

Sheng-Liang Kuo is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His role at the company allows him to work on cutting-edge technologies and contribute to advancements in semiconductor manufacturing processes. His expertise and innovative mindset have positioned him as a valuable asset in his field.

Collaborations

Sheng-Liang Kuo has collaborated with talented individuals such as Po-Yao Lin and Yu-Sheng Lin. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of innovative solutions in semiconductor technology.

Conclusion

In summary, Sheng-Liang Kuo is a prominent inventor whose work in semiconductor technology has led to significant advancements. His patent on thermal modules showcases his innovative approach to solving complex challenges in the industry. His contributions continue to influence the future of semiconductor manufacturing.