For the Inventor, By the Inventor

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Hsinchu, Taiwan

Advanced Chip Engineering Technologies Inc.

USPTO Granted Patents = 1

Forward Citations = 12

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4 inventors (with patents filed for the assignee):

Ming-Chih Yew (1 out of 122 patents)

Chang-Ann Yuan (1 out of 1 patent)

Chan-Yen Chou (1 out of 1 patent)

4. Kou-Ning Chiang (1 out of 1 patent)

1 patent: Sort by Forward Citations

1. 7884464 - 3D electronic packaging structure having a conductive support substrate (2011-02-08),

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USPTO Data Jan 1 1976 - Sep 22 2026

1 Patents

#744 in Hsinchu

#6,124 in Taiwan

Hsinchu, Taiwan

Advanced Chip Engineering Technologies Inc.

Forward Citations = 12

4 inventors:

Ming-Chih Yew (1 out of 122 patents)

Chang-Ann Yuan (1 out of 1 patent)

Chan-Yen Chou (1 out of 1 patent)

4. Kou-Ning Chiang (1 out of 1 patent)

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