The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 08, 2011
Filed:
Jun. 27, 2006
Ming-chih Yew, Hsinchu, TW;
Chang-ann Yuan, Kaohsiung, TW;
Chan-yen Chou, Wufong Township, Taichung County, TW;
Kou-ning Chiang, Hsinchu, TW;
Ming-Chih Yew, Hsinchu, TW;
Chang-Ann Yuan, Kaohsiung, TW;
Chan-Yen Chou, Wufong Township, Taichung County, TW;
Kou-Ning Chiang, Hsinchu, TW;
Advanced Chip Engineering Technologies Inc., Hsinchu, TW;
Abstract
The present invention provides a 3D electronic packaging unit having a conductive supporting substrate that can achieve multi-chip stacking through the signal contacts on the both sides of the unit. The packaging unit can be batched manufactured on wafers or substrates, and thus reduce the manufacturing cost of each individual packaging unit; moreover, the conductive supporting substrate can be utilized to provide signal transmission of the electronic elements, and the supporting substrate can be used as a ground terminal for the carried electronic elements to enhance electric performance of the electronic elements. The supporting substrate is also a good thermal conductor that can release effectively heat energy generated by the electronic elements and accumulated inside the package to the outside of the package along the substrate to enhance reliability of the packaging structure.