Average Co-Inventor Count = 5.74
ph-index = 2
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Taiwan Semiconductor Manufacturing Comp. Ltd. (46 from 40,053 patents)
46 patents:
1. 12417970 - Method for forming chip package structure
2. 12394752 - Multi-chip device and method of formation
3. 12374636 - Semiconductor device package with stress reduction design
4. 12368080 - Chip package structure with ring structure
5. 12368127 - Semiconductor chip package having underfill material surrounding a fan-out package and contacting a stress buffer structure sidewall
6. 12362256 - Method for forming semiconductor package structure
7. 12341091 - Semiconductor packages having conductive patterns of redistribution structure having ellipse-like shape
8. 12334451 - Semiconductor package including package substrate with dummy via and method of forming the same
9. 12322666 - Package assembly lid and methods for forming the same
10. 12315768 - Package assembly including lid with additional stress mitigating feet and methods of making the same
11. 12308346 - Semiconductor die with tapered sidewall in package
12. 12266635 - Semiconductor device package having dummy dies
13. 12261102 - Semiconductor package and method of forming the same
14. 12255078 - Semiconductor devices and methods of manufacturing
15. 12255156 - Semiconductor package with riveting structure between two rings and method for forming the same