Average Co-Inventor Count = 5.65
ph-index = 2
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Taiwan Semiconductor Manufacturing Comp. Ltd. (85 from 40,053 patents)
86 patents:
1. 12417970 - Method for forming chip package structure
2. 12406898 - Chip package structure with lid
3. 12394752 - Multi-chip device and method of formation
4. 12387991 - Manufacturing method of semiconductor package
5. 12387992 - Package and method for forming the same
6. 12374561 - Chip package structure with ring dam
7. 12374636 - Semiconductor device package with stress reduction design
8. 12368080 - Chip package structure with ring structure
9. 12362256 - Method for forming semiconductor package structure
10. 12362268 - Package assembly including package substrate with elongated solder resist opening and methods for forming the same
11. 12362197 - Semiconductor die package with ring structure
12. 12347793 - Semiconductor package
13. 12341091 - Semiconductor packages having conductive patterns of redistribution structure having ellipse-like shape
14. 12334451 - Semiconductor package including package substrate with dummy via and method of forming the same
15. 12327772 - Semiconductor package including stress-reduction structures and methods of forming the same