The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2026
Filed:
Jun. 27, 2022
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Chin-Hua Wang, New Taipei City, TW;
Yu-Fan Chen, Hsinchu City, TW;
Yu Chen Lee, Hsinchu City, TW;
Shin-Puu Jeng, Po-Shan Village, TW;
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Abstract
A bonded assembly includes an interposer including redistribution wiring interconnects and redistribution insulating layers and including recesses in corner regions. The recesses include surfaces that are recessed relative to a horizontal plane including a horizontal surface of the interposer. A least one semiconductor die is attached to the interposer through a respective array of solder material portions. An underfill material portion is located between the interposer and the at least one semiconductor die. The underfill material includes downward-protruding anchor portions that protrude downward from a horizontally-extending portion of the underfill material portion that laterally surrounds each array of solder material portions into the recesses.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile