This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Yu-Fan Chen and Anchor-Containing Underfill Structures for Chip Packages.
Introduction
Yu-Fan Chen is an inventor associated with Hsinchu, Taiwan, and Taiwan Semiconductor Manufacturing Company Limited. Her patent work addresses structural design in semiconductor chip packaging.
Latest Patents
The supplied information identifies one patent associated with Chen: “Anchor-Containing Underfill Structures for a Chip Package and Methods of Forming the Same.” The invention describes a bonded assembly with an interposer containing redistribution wiring interconnects and insulating layers. Recesses in the interposer’s corner regions receive downward-protruding anchor portions of the underfill material, which surrounds the solder connections between the interposer and at least one semiconductor die. This arrangement integrates the underfill with the interposer’s recessed features.
Career Highlights
Chen is associated with Taiwan Semiconductor Manufacturing Company Limited, a semiconductor company based in Taiwan. The provided information lists 1 patent for her.
Collaborations
The patent concerns a chip-package assembly involving an interposer, semiconductor die, solder material portions, and underfill material. The supplied details do not identify additional inventors or collaborators.
Conclusion
Yu-Fan Chen’s listed patent focuses on anchor-containing underfill structures that connect packaging materials through recessed features in an interposer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile