The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2026
Filed:
Jul. 25, 2024
Applicant:
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Inventors:
Chin-Hua Wang, New Taipei City, TW;
Yu-Sheng Lin, Zhubei City, TW;
PO-Yao Lin, Zhudong Township, TW;
Ming-Chih Yew, Hsinchu City, TW;
Shin-Puu Jeng, Po-Shin Village, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/42 (2006.01); H01L 21/52 (2006.01); H01L 23/053 (2006.01); H01L 23/10 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 23/42 (2013.01); H01L 21/52 (2013.01); H01L 23/053 (2013.01); H01L 23/10 (2013.01); H01L 25/0655 (2013.01);
Abstract
A package assembly includes an interposer module on a package substrate, a liquid alloy thermal interface material (TIM) on the interposer module, a seal ring surrounding the liquid alloy TIM, and a package lid on the liquid alloy TIM and seal ring, wherein the seal ring, interposer module and package lid seal the liquid alloy TIM.