The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2003
Filed:
Jan. 08, 2002
Shih-Ming Chin, Miaoli, TW;
Fang-Chuang Liu, Hsinchu, TW;
Chia-Jen Cheng, Taoyuan, TW;
Hsiu-Mei Yu, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin Chu, TW;
Abstract
A method for improving an adhesion bond between a solder material and an under bump metallization (UBM) layer including providing at least two UBM layers overlying a chip bonding pad including an uppermost UBM layer forming a contact layer for forming a solder bump thereon; depositing a solder bump precursor material overlying the contact layer to form a solder column; exposing the sidewalls of the solder column to include the contact layer sidewalls; oxidizing the contact layer sidewalls to form a contact layer sidewall oxide at a temperature lower than the melting point of the solder bump precursor material; and forming a solder bump by reflowing the precursor material to wet the contact layer surface to exclude the contact layer sidewalls.