The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 2010
Filed:
Aug. 17, 2006
Chih-min Tseng, Hsinchu County, TW;
Hsiu-mei Yu, HsinChu, TW;
Wen-hsiang Tseng, Hsinchu, TW;
Chia-jen Cheng, Taoyuan, TW;
Yu-lung Feng, Chubei, TW;
Tung-wen Hsieh, Miaoli County, TW;
Chih-Min Tseng, Hsinchu County, TW;
Hsiu-Mei Yu, HsinChu, TW;
Wen-Hsiang Tseng, Hsinchu, TW;
Chia-Jen Cheng, Taoyuan, TW;
Yu-Lung Feng, Chubei, TW;
Tung-Wen Hsieh, Miaoli County, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
A method for removing dry film resist (DFR) from a fine pitch solder bump array on a semiconductor wafer provides for pre-soaking the wafer in a chemical bath then turbulently exposing the wafer to a chemical solution, both steps taking place in batch processing with the wafers processed in a vertical position. The wafers are then individually processed through a chemical spinning operation in which a chemical solution is dispensed from a spray nozzle while motion such as spinning is imparted the horizontally disposed wafer. The spin speed of the chemical spraying process may then be increased to accelerate physical removal of residue. Deionized water rinsing and spin-drying provide a solder bump array void of any DFR or other residuals.