Yu-Lung Feng

Title: Innovations of Yu-Lung Feng in Semiconductor Technology

Introduction

Yu-Lung Feng is a notable inventor based in Chubei, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of fine pitch bump stripping. His innovative methods have the potential to enhance the efficiency and effectiveness of semiconductor manufacturing processes.

Latest Patents

Yu-Lung Feng holds a patent for a method of fine pitch bump stripping. This method involves removing dry film resist (DFR) from a fine pitch solder bump array on a semiconductor wafer. The process includes pre-soaking the wafer in a chemical bath and then exposing it turbulently to a chemical solution. Both steps are conducted in batch processing with the wafers positioned vertically. Following this, the wafers undergo a chemical spinning operation where a solution is dispensed from a spray nozzle while the wafer is spun horizontally. The spin speed is increased to facilitate the removal of any residue, and deionized water rinsing along with spin-drying ensures that the solder bump array is free of DFR or other residuals.

Career Highlights

Yu-Lung Feng is associated with Taiwan Semiconductor Manufacturing Company Ltd., a leading entity in the semiconductor industry. His work has contributed to advancements in manufacturing techniques that are crucial for the production of high-quality semiconductor devices.

Collaborations

Yu-Lung Feng has collaborated with notable colleagues such as Chih-Min Tseng and Hsiu-Mei Yu. Their combined expertise in semiconductor technology has fostered innovative solutions and improvements in manufacturing processes.

Conclusion

Yu-Lung Feng's contributions to semiconductor technology, particularly through his patented method of fine pitch bump stripping, highlight his role as an influential inventor in the industry. His work continues to impact the efficiency of semiconductor manufacturing processes.