The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2007
Filed:
Sep. 13, 2004
Tzu-han Lin, Hsinchu, TW;
Huei-mei Yu, Hsinchu, TW;
Chia-jen Cheng, Taoyuan, TW;
Chun-yen Lo, Taichung, TW;
Li-hsin Tseng, Taichung, TW;
Boe Su, Chiayi, TW;
Simon LU, Belmont, CA (US);
Tzu-Han Lin, Hsinchu, TW;
Huei-Mei Yu, Hsinchu, TW;
Chia-Jen Cheng, Taoyuan, TW;
Chun-Yen Lo, Taichung, TW;
Li-Hsin Tseng, Taichung, TW;
Boe Su, Chiayi, TW;
Simon Lu, Belmont, CA (US);
Taiwan Semiconductor Manufacturing Co. Ltd., Hsin-Chu, TW;
Abstract
Solder bump structures for semiconductor device packaging is provided. In one embodiment, a solder bump structure comprises a semiconductor substrate, the substrate has at least one contact pad and an upper passivation layer having at least one opening formed therein exposing a portion of the contact pad. At least one patterned and etched polymer layer is formed on a portion of the contact pad. At least one patterned and etched conductive metal layer is formed above the polymer layer and is aligned therewith. And at least one layer of solder material having a solder height is provided above the conductive metal layer, the layer of solder is aligned with the conductive metal layer, the layer of solder is thereafter reflown thereby creating a solder ball.