Hsinchu Hsien, Taiwan

Huei-Mei Yu


Average Co-Inventor Count = 8.2

ph-index = 2

Forward Citations = 18(Granted Patents)


Location History:

  • Hsinchu, TW (2007)
  • Hsinchu Hsien, TW (2008)

Company Filing History:


Years Active: 2007-2008

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2 patents (USPTO):Explore Patents

Title: Innovations of Inventor Huei-Mei Yu

Introduction

Huei-Mei Yu is a notable inventor based in Hsinchu Hsien, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on improving the reliability and performance of solder bump structures used in semiconductor device packaging.

Latest Patents

Huei-Mei Yu's latest patents include a method for forming solder bumps of increased height. This method enhances the reliability of solder balls after reflow by utilizing a semiconductor substrate with a contact pad and an upper passivation layer. The process involves forming a layer of under bump metal (UBM) and utilizing patterned photoresist layers to create openings for solder material. The solder material is then reflown to create a solder ball of increased height. Another patent involves solder bump structures for semiconductor device packaging, which includes a semiconductor substrate with a contact pad and a patterned polymer layer, ultimately leading to the formation of a solder ball.

Career Highlights

Huei-Mei Yu is currently employed at Taiwan Semiconductor Manufacturing Company Ltd. His innovative approaches have contributed to advancements in semiconductor manufacturing processes, particularly in the area of solder bump technology.

Collaborations

Huei-Mei Yu has collaborated with notable coworkers, including Li-Hsin Tseng and Chia-Jen Cheng, who have also contributed to the field of semiconductor technology.

Conclusion

Huei-Mei Yu's contributions to semiconductor technology through his patents and innovative methods have significantly impacted the industry. His work continues to influence advancements in the reliability and performance of semiconductor devices.

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