The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2008
Filed:
Nov. 16, 2004
Li-hsin Tseng, Taichung, TW;
Gil Huang, Hsinchu Jhubei, TW;
Huei-mei Yu, Hsinchu Hsien, TW;
Chia-jen Cheng, Taoyuan Hsien, TW;
Ken Sun, Hsinchu, TW;
Chien-tung Yu, ChangHua Hsien, TW;
Blenny Chang, Kaohsiung Hsien, TW;
Chih Yang Chan, Taichung Hsien, TW;
Jian-wen Luo, Kaohsiung Hsien, TW;
Owen Chen, Hsinchu, TW;
Li-Hsin Tseng, Taichung, TW;
Gil Huang, Hsinchu Jhubei, TW;
Huei-Mei Yu, Hsinchu Hsien, TW;
Chia-Jen Cheng, Taoyuan Hsien, TW;
Ken Sun, Hsinchu, TW;
Chien-Tung Yu, ChangHua Hsien, TW;
Blenny Chang, Kaohsiung Hsien, TW;
Chih Yang Chan, Taichung Hsien, TW;
Jian-Wen Luo, Kaohsiung Hsien, TW;
Owen Chen, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Abstract
A method for forming solder bumps (or solder balls after reflow) of improved height and reliability is provided. In one embodiment, a semiconductor substrate having at least one contact pad and an upper passivation layer having at least one opening formed therein exposing a portion of the contact pad is provided. A layer of under bump metal (UBM) is formed above the passivation layer and the contact pad. A first patterned and etched photoresist layer is provided above the UBM layer, the first patterned and etched photoresist layer defining at least one first opening therein. A second patterned and etched photoresist layer is provided above the first patterned and etched photoresist layer, the second patterned and etched photoresist layer defining at least one second opening therein, the second opening being wider than the first opening. A solder material is filled in the at least one first opening and substantially filled in the at least one second opening. The first and second photoresist layers are removed and the solder material is reflown to create a solder ball of increased height.