Blenny Chang

Title: Blenny Chang: Innovator in Semiconductor Technology

Introduction

Blenny Chang is a notable inventor based in Kaohsiung Hsien, Taiwan. He has made significant contributions to the field of semiconductor technology, holding 2 patents that enhance the reliability and efficiency of solder bump structures.

Latest Patents

Chang's latest patents include a method for forming solder bumps of increased height. This innovative method involves a semiconductor substrate with a contact pad and an upper passivation layer. The process includes forming a layer of under bump metal (UBM) and utilizing patterned photoresist layers to create openings for solder material. The result is a solder ball of increased height, which improves reliability in semiconductor applications. Another patent focuses on reducing UBM undercut, which is crucial for manufacturing solder bump structures on semiconductor devices. This method also involves a bonding pad and a passivation layer, ensuring that the solder bump structure is robust and effective.

Career Highlights

Blenny Chang is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work has been instrumental in advancing technologies that are critical for modern electronics.

Collaborations

Chang has collaborated with notable colleagues such as Gil Huang and Li-Hsin Tseng, contributing to various projects that push the boundaries of semiconductor technology.

Conclusion

Blenny Chang's innovative work in semiconductor technology, particularly in solder bump structures, showcases his expertise and commitment to advancing the field. His contributions are vital for the ongoing development of reliable electronic components.