The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2008
Filed:
Dec. 29, 2006
Blenny Chang, Kaohsiung, TW;
Hsiu-mei Yu, Hsinchu, TW;
Gil Huang, Hsinchu, TW;
Sung-cheng Chiu, Hsinchu, TW;
Blenny Chang, Kaohsiung, TW;
Hsiu-Mei Yu, Hsinchu, TW;
Gil Huang, Hsinchu, TW;
Sung-Cheng Chiu, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
A method of manufacturing a solder bump structure on a semiconductor device is provided. In one embodiment, a semiconductor substrate is provided having a bonding pad and a passivation layer formed thereabove, the passivation layer having an opening therein exposing a portion of the bonding pad. A first under bump metallization (UBM) layer is formed over the bonding pad and the passivation layer. A mask layer is placed over the first UBM layer, the mask layer having an opening therein exposing a portion of the first UBM layer. The mask layer is thereafter etched to create a recess at the edges between the first UBM layer and the mask layer. A second UBM layer is deposited in the opening of the mask layer, the second UBM layer filling the recess and a portion of the opening of the mask layer.