Sung-Cheng Chiu

Title: Innovations of Sung-Cheng Chiu in Semiconductor Technology

Introduction

Sung-Cheng Chiu is a notable inventor based in Hsinchu, Taiwan, recognized for his contributions to semiconductor technology. He holds three patents that showcase his expertise in manufacturing processes related to solder bump structures on semiconductor devices. His work has significantly impacted the efficiency and reliability of semiconductor manufacturing.

Latest Patents

One of his latest patents is titled "Method to reduce UBM undercut." This invention provides a method for manufacturing a solder bump structure on a semiconductor device. In this method, a semiconductor substrate is prepared with a bonding pad and a passivation layer. The passivation layer has an opening that exposes a portion of the bonding pad. A first under bump metallization (UBM) layer is formed over both the bonding pad and the passivation layer. A mask layer is then placed over the first UBM layer, which has an opening exposing part of the first UBM layer. The mask layer is etched to create a recess at the edges between the first UBM layer and the mask layer. Finally, a second UBM layer is deposited in the opening of the mask layer, filling the recess and part of the opening.

Another significant patent is the "Method for forming high reliability bump structure." This method involves forming a bump on a semiconductor substrate that has a contact pad. The process includes depositing a passivation layer over the substrate and contact pad, followed by patterning and etching the passivation layer to create openings that expose portions of the contact pad. An under bump metallurgy (UBM) layer is then deposited to contact the contact pad through these openings. A photoresist layer is formed on the UBM layer, which is then patterned and etched to create an opening over the contact pad. An electrically conductive material is deposited into this opening and aligned with the contact pad. The remaining photoresist layer is partially removed, and the UBM layer is etched using the conductive material as a mask. The conductive material is then reflowed to create a bump on the semiconductor substrate.

Career Highlights

Sung-Cheng Chiu is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His innovative approaches and patented methods have contributed to advancements in semiconductor manufacturing processes.

Collaborations

He has collaborated with notable colleagues, including Hsiu-Mei Yu and Hao-Y