Location History:
- Hsinchu Jhubei, TW (2008)
- Hsinchu, TW (2008)
Company Filing History:
Years Active: 2008
Title: Gil Huang: Innovator in Semiconductor Technology
Introduction
Gil Huang is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of solder bump formation. With a total of 3 patents to his name, Huang's work has advanced the reliability and efficiency of semiconductor devices.
Latest Patents
Huang's latest patents include a method for forming solder bumps of increased height. This innovative method enhances the reliability of solder balls after reflow by utilizing a semiconductor substrate with a contact pad and an upper passivation layer. The process involves forming a layer of under bump metal (UBM) and utilizing patterned photoresist layers to create openings for solder material. The result is a solder ball of increased height, which is crucial for modern semiconductor applications.
Another notable patent is a method to reduce UBM undercut. This method focuses on manufacturing a solder bump structure on a semiconductor device. It involves forming a bonding pad and passivation layer, followed by the deposition of UBM layers. The technique ensures that the solder bump structure is robust and minimizes defects, thereby improving overall device performance.
Career Highlights
Gil Huang is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work at TSMC has allowed him to collaborate with some of the brightest minds in the field, contributing to groundbreaking advancements in semiconductor manufacturing.
Collaborations
Huang has worked alongside talented colleagues such as Hsiu-Mei Yu and Chien-Tung Yu. Their collaborative efforts have fostered an environment of innovation and excellence within the company.
Conclusion
Gil Huang's contributions to semiconductor technology through his patents and work at TSMC highlight his role as a key innovator in the industry. His methods for improving solder bump formation are essential for the advancement of reliable semiconductor devices.