Jian-Wen Luo

Title: The Innovative Contributions of Jian-Wen Luo

Introduction

Jian-Wen Luo is a prominent inventor based in Kaohsiung Hsien, Taiwan. He is known for his significant contributions to the field of semiconductor technology. With a focus on improving the reliability and height of solder bumps, his work has implications for various electronic applications.

Latest Patents

Jian-Wen Luo holds a patent titled "Method for forming solder bumps of increased height." This innovative method enhances the formation of solder bumps, which are crucial for semiconductor devices. The process involves a semiconductor substrate with contact pads and a passivation layer, where openings are created to expose the pads. A layer of under bump metal is applied, followed by a patterned photoresist layer that defines openings for solder material. The method ultimately results in solder balls of increased height, improving device performance and reliability.

Career Highlights

Luo's career is marked by his role at Taiwan Semiconductor Manufacturing Company Limited, where he has made significant advancements in semiconductor manufacturing processes. His expertise in solder bump technology has positioned him as a key figure in the industry.

Collaborations

Throughout his career, Jian-Wen Luo has collaborated with notable colleagues, including Li-Hsin Tseng and Gil Huang. These partnerships have fostered innovation and contributed to the development of advanced semiconductor technologies.

Conclusion

Jian-Wen Luo's contributions to the field of semiconductor technology, particularly through his patented method for forming solder bumps, highlight his role as an influential inventor. His work continues to impact the industry, enhancing the reliability and performance of electronic devices.