Chien-Tung Yu

Title: Chien-Tung Yu: Innovator in Semiconductor Packaging

Introduction

Chien-Tung Yu is a prominent inventor based in Changhua Hsien, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 3 patents. His innovative work focuses on enhancing the reliability and efficiency of semiconductor devices.

Latest Patents

One of his latest patents is titled "Package and method for forming the same." This invention describes a package that includes a redistribution structure with a first dielectric layer and a first conductive element. A first semiconductor device is bonded to this structure, featuring a first corner, while an underfill is disposed over the redistribution structure, ensuring that the first protrusion overlaps the first corner in a plan view.

Another notable patent is "Method for forming solder bumps of increased height." This method provides a way to create solder bumps with improved height and reliability. It involves a semiconductor substrate with a contact pad and an upper passivation layer. The process includes forming a layer of under bump metal, applying patterned photoresist layers, and filling solder material to create a solder ball of increased height after reflow.

Career Highlights

Chien-Tung Yu is currently associated with Taiwan Semiconductor Manufacturing Company Limited, where he continues to innovate in semiconductor technology. His work has been instrumental in advancing packaging methods that enhance device performance.

Collaborations

He has collaborated with notable colleagues, including Gil Huang and Owen Chen, contributing to various projects that push the boundaries of semiconductor technology.

Conclusion

Chien-Tung Yu's contributions to semiconductor packaging through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence the development of reliable and efficient semiconductor devices.