Chih Yang Chan

Title: Innovations by Chih Yang Chan

Introduction

Chih Yang Chan is a notable inventor based in Taichung Hsien, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of solder bump formation. His innovative methods have enhanced the reliability and performance of electronic components.

Latest Patents

Chih Yang Chan holds a patent for a "Method for forming solder bumps of increased height." This invention provides a method for creating solder bumps, or solder balls after reflow, that exhibit improved height and reliability. The process involves a semiconductor substrate with contact pads and a passivation layer, which has openings exposing the contact pads. A layer of under bump metal (UBM) is formed above these layers, followed by the application of patterned photoresist layers that define openings for solder material. The solder is then reflown to create a solder ball of increased height, enhancing the overall performance of the semiconductor device. He has 1 patent to his name.

Career Highlights

Chih Yang Chan is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work has contributed to advancements in manufacturing processes and product reliability.

Collaborations

Chih Yang Chan has collaborated with notable colleagues, including Li-Hsin Tseng and Gil Huang. Their combined expertise has fostered innovation and development in semiconductor technologies.

Conclusion

Chih Yang Chan's contributions to the field of semiconductor technology through his innovative patent demonstrate his commitment to enhancing electronic component reliability. His work continues to influence the industry positively.