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For the Inventor, By the Inventor

Hsinchu, Taiwan

Tzu-Han Lin

This inventor holds 27 USPTO granted patents and 6 published patent applications and 3 EPO patents, primarily in Image Sensor Packaging. Top assignees: Visera Technologies Company Limited, Taiwan Semiconductor Manufacturing Comp. Ltd., Omnivision Technologies, Inc.. Active years: 2006-2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tzu-Han Lin. Retrieved from https://idiyas.com/inventor/tzu-han-lin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 27 

% Patents Active = 70.4


Average Co-Inventor Count = 3.4

ph-index = 7

Forward Citations = 185(Granted Patents)


Location History:

  • Hshinchu, TW (2010)
  • Hsinchu County, TW (2013)
  • Hsinchu, TW (2006 - 2016)

Company Filing History:

goldMedal25 out of 262 
 
Visera Technologies Company Limited
 patents
silverMedal2 out of 42,926 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
bronzeMedal1 out of 1,417 
 
Omnivision Technologies, Inc.
 patents
where one patent can have more than one assignee

Years Active: 2006-2016

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Areas of Expertise:
Image Sensor Package
Wafer Level Image Module
Light-Emitting Diode
Electronic Assembly
Fabrication Method
Optoelectronic Device
Isolation Structures
Chip Scale Packages
Bump Structure
EMC Coating
27 patents (USPTO):Explore Patents
1. 9484385 - Method for fabricating an image sensor package (2016-11-01),
2. 9231012 - Image sensor package (2016-01-05),
3. 8524521 - Method for making wafer level image module (2013-09-03),
4. 8502257 - Light-emitting diode package (2013-08-06),
5. 8399969 - Chip package and fabricating method thereof (2013-03-19),
6. 8153458 - Image sensing devices and methods for fabricating the same (2012-04-10),
7. 7994598 - Electronic assembly for image sensor device (2011-08-09),
8. 7994531 - White-light light emitting diode chips and fabrication methods thereof (2011-08-09),
9. 7964936 - Electronic device package with electromagnetic compatibility (EMC) coating thereon (2011-06-21),
10. 7932529 - Light-emitting diode device and method for fabricating the same (2011-04-26),
11. 7928655 - Light-emitting diode device and method for fabricating the same (2011-04-19),
12. 7928458 - Light-emitting diode device and method for fabricating the same (2011-04-19),
13. 7898070 - Image sensor package and fabrication method thereof (2011-03-01),
14. 7860357 - Optoelectronic device chip having a composite spacer structure and method making same (2010-12-28),
15. 7833810 - Method of fabricating isolation structures for CMOS image sensor chip scale packages (2010-11-16),

Title: The Innovative Journey of Tzu-Han Lin

Introduction: Tzu-Han Lin, a visionary inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions.

Latest Patents: Tzu-Han Lin holds several patents in the areas of semiconductor technology and renewable energy, showcasing his versatility and ingenuity in creating solutions for the modern world.

Career Highlights: With a background in engineering and a passion for innovation, Tzu-Han Lin has had a successful career marked by his ability to translate ideas into tangible products that have a positive impact on society.

Collaborations: Throughout his career, Tzu-Han Lin has collaborated with leading research institutions and technology companies to further develop and commercialize his inventions, demonstrating his commitment to pushing the boundaries of technological advancement.

Conclusion: Tzu-Han Lin's dedication to innovation and his relentless pursuit of excellence have solidified his reputation as a pioneering inventor in the global tech industry, leaving a lasting legacy for future generations to build upon.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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