The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2016
Filed:
Aug. 01, 2007
Jui-ping Weng, Miaoli, TW;
Jang-cheng Hsieh, Hsinchu, TW;
Tzu-han Lin, Hsinchu, TW;
Pai-chun Peter Zung, Hsinchu, TW;
Jui-Ping Weng, Miaoli, TW;
Jang-Cheng Hsieh, Hsinchu, TW;
Tzu-Han Lin, Hsinchu, TW;
Pai-Chun Peter Zung, Hsinchu, TW;
VISERA TECHNOLOGIES COMPANY LIMITED, Hsinchu, TW;
Abstract
An image sensor package and method for fabricating the same is provided. The image sensor package includes a first substrate comprising a via therein, a driving circuit and a first conductive pad thereon. A second substrate comprising a photosensitive device and a second conductive pad thereon is bonded to the first substrate, so that the driving circuit, formed on the first substrate, can electrically connect to and further control the photosensitive device, formed on the second substrate. A solder ball is formed on a backside of the first substrate and electrically connects to the via for transmitting a signal from the driving circuit. Because the photosensitive device and the driving circuit are fabricated individually on the different substrates, fabrication and design thereof is more flexible. Moreover, the image sensor package is relatively less thick, thus, the dimensions thereof are reduced.