The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 2010
Filed:
Jun. 29, 2009
Tzu-han Lin, Hshinchu, TW;
Tzy-ying Lin, Hsinchu, TW;
Fang-chang Liu, Hsinchu, TW;
Kai-chih Wang, Taoyuan, TW;
Tzu-Han Lin, Hshinchu, TW;
Tzy-Ying Lin, Hsinchu, TW;
Fang-Chang Liu, Hsinchu, TW;
Kai-Chih Wang, Taoyuan, TW;
VisEra Technologies Company Limited, Hsinchu, TW;
Abstract
Isolation structure for CMOS image sensor device chip scale packages and fabrication methods thereof. A CMOS image sensor chip scale package includes a transparent substrate configured as a support structure for the package. The transparent substrate includes a first cutting edge and a second cutting edge. A CMOS image sensor die with a die circuitry is mounted on the transparent substrate. An encapsulant is disposed on the substrate encapsulating the CMOS image sensor die. A connection extends from the die circuitry to a plurality of terminal contacts for the package on the encapsulant, wherein the connection is exposed by the first cutting edge. An isolation structure is disposed on the first cutting edge passivating the exposed connection and co-planed with the second cutting edge.