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For the Inventor, By the Inventor

Hsinchu, Taiwan

Chun-Yen Lo

This inventor holds 13 USPTO granted patents and 4 published patent applications, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2006-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chun-Yen Lo. Retrieved from https://idiyas.com/inventor/chun-yen-lo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 13 

% Patents Active = 92.3

Average Co-Inventor Count = 6.0

ph-index = 3

Forward Citations = 40(Granted Patents)


Location History:

  • Taichung, TW (2006 - 2007)
  • Hsinchu, TW (2018 - 2024)

Company Filing History:

goldMedal13 out of 43,653 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2006-2025

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Areas of Expertise:
Semiconductor Package
Bonding Workpieces
Conductive Connector
Bump Layout
Edge Gradients
Manufacturing Method
Pad Redistribution Layer
Thermal Management
3D Stacking
13 patents (USPTO):Explore Patents
1. 12406970 - Semiconductor package and method of bonding workpieces (2025-09-02),
2. 12381191 - Semiconductor package, method of bonding workpieces and method of manufacturing semiconductor package (2025-08-05),
3. 12087618 - Method for forming semiconductor die having edge with multiple gradients (2024-09-10),
4. 11908843 - Semiconductor package, method of bonding workpieces and method of manufacturing semiconductor package (2024-02-20),
5. 11527504 - Conductive external connector structure and method of forming (2022-12-13),
6. 11211318 - Bump layout for coplanarity improvement (2021-12-28),
7. 11004728 - Semiconductor die having edge with multiple gradients and method for forming the same (2021-05-11),
8. 10741513 - Conductive external connector structure and method of forming (2020-08-11),
9. 10535554 - Semiconductor die having edge with multiple gradients and method for forming the same (2020-01-14),
10. 10163836 - Conductive external connector structure and method of forming (2018-12-25),
11. 9875979 - Conductive external connector structure and method of forming (2018-01-23),
12. 7187078 - Bump structure (2007-03-06),
13. 7122458 - Method for fabricating pad redistribution layer (2006-10-17),

Title: The Innovative Journey of Inventor Chun-Yen Lo

Introduction: Chun-Yen Lo, a pioneering inventor hailing from Hsinchu, Taiwan, has made significant contributions to the world of technology and innovation through his groundbreaking inventions and patents.

Latest Patents: Chun-Yen Lo holds several patents in the field of semiconductor technology, including a recent patent for a novel method of enhancing chip performance through advanced materials integration.

Career Highlights: With a career spanning over two decades, Chun-Yen Lo has worked with leading tech companies and research institutions, playing a key role in developing cutting-edge technologies that have revolutionized the industry.

Collaborations: Throughout his career, Chun-Yen Lo has collaborated with top engineers, scientists, and researchers from around the globe, fostering a culture of innovation and excellence in all his projects.

Conclusion: Inventor Chun-Yen Lo's relentless pursuit of innovation and his passion for pushing the boundaries of technology have solidified his reputation as a visionary in the field of semiconductor technology. His contributions continue to inspire future generations of inventors and innovators worldwide.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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