The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2020
Filed:
Dec. 19, 2018
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Meng-Fu Shih, Taichung, TW;
Chun-Yen Lo, Hsinchu, TW;
Cheng-Lin Huang, Hsinchu, TW;
Wen-Ming Chen, Zhunan Township, TW;
Chien-Ming Huang, Hsinchu, TW;
Yuan-Fu Liu, Kaohsiung, TW;
Yung-Chiuan Cheng, Kaohsiung, TW;
Wei-Chih Huang, Taipei, TW;
Chen-Hsun Liu, Tainan, TW;
Chien-Pin Chan, Pingzhen, TW;
Yu-Nu Hsu, Tainan, TW;
Chi-Hung Lin, Kaohsiung, TW;
Te-Hsun Pang, Tainan, TW;
Chin-Yu Ku, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
External electrical connectors and methods of forming such external electrical connectors are discussed. A method includes forming an external electrical connector structure on a substrate. The forming the external electrical connector structure includes plating a pillar on the substrate at a first agitation level affected at the substrate in a first solution. The method further includes plating solder on the external electrical connector structure at a second agitation level affected at the substrate in a second solution. The second agitation level affected at the substrate is greater than the first agitation level affected at the substrate. The plating the solder further forms a shell on a sidewall of the external electrical connector structure.