Wen-Ming Chen

This inventor holds 18 USPTO granted patents and 1 published patent application, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2004-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wen-Ming Chen. Retrieved from https://idiyas.com/inventor/wen-ming-chen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 18 (Patent Applications = 1)

% Patents Active = 83.3

Average Co-Inventor Count = 5.0

ph-index = 3

Forward Citations = 26(Granted Patents)

Location History:

Miaoli, TW (2004 - 2008)
Miaoli County, TW (2019 - 2020)
Zhunan Township, TW (2017 - 2022)
Zhunan Township, Miaoli County, TW (2018 - 2024)

Company Filing History:

18 out of 42,965

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2004-2024

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Areas of Expertise:

Semiconductor Die

Conductive Connector

Wafer Taping

Die Singulation

Bump Layout

Composite Shadow Ring

Bonding Apparatus

Backfill Prevention

Microchip Fabrication

Gas Flow Conduit

Edge Gradients

Wafer Detection

18 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12087618 - Method for forming semiconductor die having edge with multiple gradients (2024-09-10),

2. 11527504 - Conductive external connector structure and method of forming (2022-12-13),

3. 11367658 - Semiconductor die singulation and structures formed thereby (2022-06-21),

4. 11211318 - Bump layout for coplanarity improvement (2021-12-28),

5. 11004728 - Semiconductor die having edge with multiple gradients and method for forming the same (2021-05-11),

6. 10861761 - Semiconductor packaged wafer and method for forming the same (2020-12-08),

7. 10741513 - Conductive external connector structure and method of forming (2020-08-11),

8. 10720360 - Semiconductor die singulation and structures formed thereby (2020-07-21),

9. 10535554 - Semiconductor die having edge with multiple gradients and method for forming the same (2020-01-14),

10. 10510605 - Semiconductor die singulation and structures formed thereby (2019-12-17),

11. 10312118 - Bonding apparatus and method (2019-06-04),

12. 10163836 - Conductive external connector structure and method of forming (2018-12-25),

13. 10014218 - Method for forming semiconductor device structure with bumps (2018-07-03),

14. 9875979 - Conductive external connector structure and method of forming (2018-01-23),

15. 9748130 - Wafer taping scheme (2017-08-29),

Title: The Innovative Journey of Wen-Ming Chen

Introduction: Wen-Ming Chen, a talented inventor hailing from Zhunan, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents: Chen's latest patents showcase his ingenuity and forward-thinking approach to innovation, with a focus on advancements in renewable energy technologies and sustainable solutions for a greener future.

Career Highlights: Throughout his illustrious career, Wen-Ming Chen has been recognized for his exceptional problem-solving skills and ability to translate complex ideas into practical inventions. His dedication to research and development has led to the creation of numerous cutting-edge technologies that have had a lasting impact on various industries.

Collaborations: Chen has collaborated with leading research institutions, universities, and companies around the world to further his research and bring his inventions to life. His collaborative spirit and passion for innovation have been instrumental in driving progress in the field of technology.

Conclusion: In conclusion, Wen-Ming Chen's innovative spirit and relentless pursuit of excellence have solidified his reputation as a visionary inventor. His contributions to the world of technology continue to inspire future generations of inventors and pave the way for a more sustainable and technologically advanced future.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

1 patent pending: