The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2020
Filed:
Feb. 21, 2018
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Fu-Chen Chang, Hsinchu, TW;
Cheng-Lin Huang, Hsinchu, TW;
Wen-Ming Chen, Miaoli County, TW;
Shih-Yen Chen, Hsinchu, TW;
Ruei-Yi Tsai, Chiayi, TW;
Pin-Yi Hsin, Hsinchu County, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Abstract
Present disclosure provides a method for forming a semiconductor packaged wafer, including providing a semiconductor package having a die on a first side of a wafer, partially molding the die by disposing molding material on the first side of the wafer, a peripheral of the first side is free of molding material at a completion of the partially molding, and bonding the semiconductor package with a carrier from the first side of the wafer. Present disclosure also provides a semiconductor packaged wafer, including a die on a first side of a wafer, a molding encapsulating the die and partially positioning on the first side of the wafer by retracting from a peripheral of the first side of the wafer, and a sealing structure on the peripheral of the first side of the wafer.