Shih-Yen Chen

Title: Inventor Shih-Yen Chen: Innovations in Semiconductor Bonding

Introduction

Shih-Yen Chen, a prominent inventor located in Hsinchu, Taiwan, has made significant contributions to the field of semiconductor technology. With a total of nine patents to his name, Chen has demonstrated his innovative prowess through groundbreaking inventions that enhance semiconductor bonding processes.

Latest Patents

Among his latest patents is a bonding tool and bonding method, which introduces an advanced technique for attaching semiconductor dies. This method involves the use of a bonding tool featuring a bending member, which flexibly moves within a trench of the tool. The bending member assists in bending the semiconductor die and facilitates its movement toward a semiconductor wafer, enabling a seamless bonding process. The patent emphasizes the importance of both partial and full bonding between the semiconductor die and wafer, showcasing Chen's innovative approach to improving semiconductor assembly.

Another notable patent is the development of a package structure with a barrier layer. This innovative structure consists of a first bump structure formed over a substrate, featuring a pillar layer and a barrier layer. The barrier layer is designed with a protruding portion extending beyond the first edge of the pillar layer, providing enhanced connectivity. The subsequent incorporation of a second bump structure bonded through a solder joint showcases Chen's forward-thinking methods in maximizing package integrity and performance.

Career Highlights

Shih-Yen Chen has collaborated with leading companies in the semiconductor industry, including Taiwan Semiconductor Manufacturing Company Ltd. and Macronix International Co., Ltd. His work in these organizations has allowed him to bring his inventions to life, significantly impacting the manufacturing and design of semiconductors.

Collaborations

Throughout his career, Chen has worked alongside esteemed colleagues, such as Yu-Nu Hsu and Chun-Chen Liu. These collaborations have fostered an environment of innovation and creativity, further driving advancements in semiconductor technology.

Conclusion

Shih-Yen Chen stands out as a notable figure in the world of semiconductor inventions. His nine patents, particularly in bonding tools and package structures, reflect a deep understanding of the complexities involved in semiconductor manufacturing. Through his career and collaborations, Chen continues to pave the way for future innovations that will undoubtedly shape the industry for years to come.