The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2003
Filed:
Mar. 22, 2002
Applicant:
Inventors:
Shih-Yen Chen, Hsinchu, TW;
Chao-Chuan Tseng, Hsin Chu, TW;
Assignee:
Macronix International Co., Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 3/126 ; H01L 2/166 ;
U.S. Cl.
CPC ...
H01L 3/126 ; H01L 2/166 ;
Abstract
A method for monitoring particles and defects on a wafer surface and in a process is described, which uses a monitoring instrument to detect particles and defects possibly present on a substantially effective surface of a wafer. Before the monitoring step, a substantially uniform conformal layer is formed on the substantially effective surface of the wafer, wherein the thickness of the conformal layer is controlled so that the apparent sizes of the particles and the defects possibly present on the wafer surface can be increased moderately.