The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2020
Filed:
Nov. 19, 2018
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Cheng-Hung Chen, Tainan, TW;
Yu-Nu Hsu, Tainan, TW;
Chun-Chen Liu, Kaohsiung, TW;
Heng-Chi Huang, Zhudong Township, Hsinchu County, TW;
Chien-Chen Li, Hsinchu, TW;
Shih-Yen Chen, Hsinchu, TW;
Cheng-Nan Hsieh, Chubei, TW;
Kuo-Chio Liu, Hsinchu, TW;
Chen-Shien Chen, Zhubei, TW;
Chin-Yu Ku, Hsinchu, TW;
Te-Hsun Pang, Tainan, TW;
Yuan-Feng Wu, Tainan, TW;
Sen-Chi Chiang, Tainan, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Abstract
A package structure is provided. The package structure includes a first bump structure formed over a substrate, a solder joint formed over the first bump structure and a second bump structure formed over the solder joint. The first bump structure includes a first pillar layer formed over the substrate and a first barrier layer formed over the first pillar layer. The first barrier layer has a first protruding portion which extends away from a sidewall surface of the first pillar layer, and a distance between the sidewall surface of the first pillar layer and a sidewall surface of the first barrier layer is in a range from about 0.5 μm to about 3 μm. The second bump structure includes a second barrier layer formed over the solder joint and a second pillar layer formed over the second barrier layer, wherein the second barrier layer has a second protruding portion which extends away from a sidewall surface of the second pillar layer.