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Kuo-Chio Liu

This inventor holds 49 USPTO granted patents and 14 published patent applications, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2000-2026.

USPTO Granted Patents = 49 (Patent Applications = 14)

% Patents Active = 95.9

Average Co-Inventor Count = 5.7

ph-index = 6

Forward Citations = 150(Granted Patents)

Company Filing History:

48 out of 42,759

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

1 out of 463

Taiwan Semiconductor Manufacturing Co., Ltd.

patents

Years Active: 2000-2026

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Areas of Expertise:

Multi-Die Package

Integrated Circuit Packages

Chip Package Structure

Barrier Layer

Template Layer

Elliptical Columns

Semiconductor Structure

Bump Layout

High Voltage Device

Non-Volatile Memory

ESD Protection Device

Twin Current Bipolar Device

49 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12751292 - Package structure including ring structure attached by hybrid adhesive and methods of forming the same (2026-09-29),

2. 12666968 - Semiconductor device and method forming same (2026-06-23),

3. 12557646 - Multi-die package and methods of formation (2026-02-17),

4. 12512331 - Dummy through vias for integrated circuit packages and methods of forming the same (2025-12-30),

5. 12463192 - Method of forming integrated circuit packages by bonding package component having first carrier to package substrate having second carrier (2025-11-04),

6. 12334489 - Lthc as charging barrier in info package formation (2025-06-17),

7. 12183709 - Chip package structure with ring-like structure (2024-12-31),

8. 12087618 - Method for forming semiconductor die having edge with multiple gradients (2024-09-10),

9. 12051634 - Package and package-on-package structure having elliptical columns and ellipsoid joint terminals (2024-07-30),

10. 12046588 - Package on package structure (2024-07-23),

11. 11984419 - Package structure with a barrier layer (2024-05-14),

12. 11923353 - LTHC as charging barrier in info package formation (2024-03-05),

13. 11848302 - Chip package structure with ring-like structure (2023-12-19),

14. 11756849 - Package and package-on-package structure having elliptical columns and ellipsoid joint terminals (2023-09-12),

15. 11594484 - Forming bonding structures by using template layer as templates (2023-02-28),

Title: The Innovative Journey of Inventor Kuo-Chio Liu

Introduction: Kuo-Chio Liu, a talented inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Kuo-Chio Liu holds several patents in the areas of semiconductor technology and electronic devices, showcasing his expertise and creativity in these domains.

Career Highlights: Throughout his illustrious career, Kuo-Chio Liu has worked with leading tech companies and research institutions, where he has spearheaded projects that have pushed the boundaries of innovation.

Collaborations: Kuo-Chio Liu has collaborated with top engineers, scientists, and researchers from around the world, fostering a culture of innovation and knowledge sharing in the tech industry.

Conclusion: In conclusion, Kuo-Chio Liu's passion for innovation and his relentless pursuit of excellence have established him as a prominent figure in the world of technology, inspiring future generations of inventors to dream big and think outside the box.

Profile summary based on public USPTO records.

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