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For the Inventor, By the Inventor

Hsinchu, Taiwan

Kuo-Chio Liu

USPTO Granted Patents = 45 

Average Co-Inventor Count = 5.8

ph-index = 6

Forward Citations = 147(Granted Patents)


Company Filing History:

goldMedal45 out of 40,780 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2000-2025

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Areas of Expertise:
Integrated Circuit Packages
Chip Package Structure
Semiconductor Die
Package-on-Package Structure
Barrier Layer
Bump Layout
High Voltage Devices
Non-Volatile Memory Cells
Bipolar Devices
ESD Protection Devices
Intermetallic Compounds
Template Layer
45 patents (USPTO):Explore Patents
1. 12463192 - Method of forming integrated circuit packages by bonding package component having first carrier to package substrate having second carrier (2025-11-04),
2. 12334489 - Lthc as charging barrier in info package formation (2025-06-17),
3. 12183709 - Chip package structure with ring-like structure (2024-12-31),
4. 12087618 - Method for forming semiconductor die having edge with multiple gradients (2024-09-10),
5. 12051634 - Package and package-on-package structure having elliptical columns and ellipsoid joint terminals (2024-07-30),
6. 12046588 - Package on package structure (2024-07-23),
7. 11984419 - Package structure with a barrier layer (2024-05-14),
8. 11923353 - LTHC as charging barrier in info package formation (2024-03-05),
9. 11848302 - Chip package structure with ring-like structure (2023-12-19),
10. 11756849 - Package and package-on-package structure having elliptical columns and ellipsoid joint terminals (2023-09-12),
11. 11594484 - Forming bonding structures by using template layer as templates (2023-02-28),
12. 11545463 - Chip package structure with ring-like structure (2023-01-03),
13. 11469203 - Method for forming package structure with a barrier layer (2022-10-11),
14. 11437361 - LTHC as charging barrier in InFO package formation (2022-09-06),
15. 11404341 - Package and package-on-package structure having elliptical columns and ellipsoid joint terminals (2022-08-02),

Title: The Innovative Journey of Inventor Kuo-Chio Liu

Introduction: Kuo-Chio Liu, a talented inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Kuo-Chio Liu holds several patents in the areas of semiconductor technology and electronic devices, showcasing his expertise and creativity in these domains.

Career Highlights: Throughout his illustrious career, Kuo-Chio Liu has worked with leading tech companies and research institutions, where he has spearheaded projects that have pushed the boundaries of innovation.

Collaborations: Kuo-Chio Liu has collaborated with top engineers, scientists, and researchers from around the world, fostering a culture of innovation and knowledge sharing in the tech industry.

Conclusion: In conclusion, Kuo-Chio Liu's passion for innovation and his relentless pursuit of excellence have established him as a prominent figure in the world of technology, inspiring future generations of inventors to dream big and think outside the box.

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