The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2026
Filed:
Mar. 28, 2023
Applicant:
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Inventors:
Wen-Yi Lin, New Taipei City, TW;
Yi-Che Chiang, Hsinchu, TW;
Chien-Chen Li, Hsinchu, TW;
Chien-Li Kuo, Hsinchu City, TW;
Kuo-Chio Liu, Hsinchu City, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 42/00 (2026.01); H10B 80/00 (2026.01); H10W 74/15 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 42/121 (2026.01); H10B 80/00 (2023.02); H10W 90/00 (2026.01); H10W 74/15 (2026.01); H10W 90/724 (2026.01); H10W 90/734 (2026.01);
Abstract
A package structure includes a package substrate, a semiconductor die module on the package substrate, a ring structure on the package substrate adjacent to the semiconductor die module, and a hybrid adhesive having a first modulus and a second modulus less than the first modulus and attaching the ring structure to the package substrate.