Hsinchu, Taiwan

Chien-Li Kuo

USPTO Granted Patents = 116 

Average Co-Inventor Count = 2.2

ph-index = 13

Forward Citations = 554(Granted Patents)

Forward Citations (Not Self Cited) = 526(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Hsinchu Hsien, TW (1999 - 2001)
  • Hsinchu, TW (2000 - 2024)

Company Filing History:


Years Active: 1999-2025

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Areas of Expertise:
Integrated Circuit Packaging
Image Sensor Manufacturing
Thermal Interface Materials
Trench Capacitors
Group Iii-V Device Structures
Through Silicon Via
Fan-Out Wafer Level Package
Interposer Fabrication
Semiconductor Device Structures
Wafer Packaging
Thermal Expansion Mismatch
Chip Bonding Techniques
116 patents (USPTO):Explore Patents

Title: Chien-Li Kuo: Pioneering Innovations in Technology and Manufacturing

Introduction:

Chien-Li Kuo, a remarkable inventor hailing from Hsinchu, Taiwan, has significantly contributed to various industries, including technology, electronics, and manufacturing. Known for his revolutionary creations and remarkable problem-solving abilities, Kuo has received well-deserved recognition and numerous patents throughout his illustrious career. This article explores his latest patents, career highlights, collaborations, and the lasting impact of his innovations.

Latest Patents:

Chien-Li Kuo's ingenuity and expertise have resulted in an impressive track record of 105 patented inventions. Among his recent patents, two notable advancements stand out:

1. Semiconductor Device Package with Metal Thermal Interface Material:

Kuo's invention addresses the challenge of efficient heat dissipation in semiconductor device packages. This method involves bonding a semiconductor device to a package substrate, utilizing a metal thermal interface material (TIM) between the device and the package lid. By carefully heating and manipulating the molten metal TIM, Kuo ensures optimal heat flow and firmly bonds the lid to the semiconductor device. This breakthrough offers enhanced thermal management and improved overall system performance.

2. Low Warpage High Density Trench Capacitor:

In this invention, Kuo tackles the design and fabrication challenges associated with high-density trench capacitors. By using a two-dimensional trench array with rotationally symmetric segments, Kuo creates a doped substrate with recesses for conducting layers. The resulting capacitor structure offers improved conductance, reduced warpage, and higher density, allowing for advanced integrated circuit designs and improved performance.

Career Highlights:

Chien-Li Kuo's career is studded with remarkable accomplishments and groundbreaking innovations. Notably, he has made significant contributions while working with prominent technology companies:

1. United Microelectronics Corporation (UMC):

Kuo's association with UMC played a crucial role in his professional journey. While serving in this renowned semiconductor foundry, he not only honed his skills but also had the opportunity to collaborate with industry experts on cutting-edge projects. His inventions during this period laid the foundation for his subsequent breakthroughs.

2. Taiwan Semiconductor Manufacturing Company Limited (TSMC):

Kuo's tenure at TSMC marked a significant phase in his career. As one of the world's largest semiconductor chip manufacturers, TSMC provided an ideal platform for Kuo to unleash his creativity and expertise. Collaborating with fellow innovators, he contributed to numerous pioneering projects that have enabled advancements in electronic devices and computing technology.

Collaborations:

Throughout his career, Chien-Li Kuo has fostered productive collaborations with talented individuals, including the following notable coworkers:

1. Sun-Chieh Chien:

Working closely with Chien, Kuo was able to bring his inventive ideas to fruition. The combined expertise of these two innovators led to the creation of groundbreaking solutions, redefining several aspects of technology and manufacturing. Their collaborations exemplify the power of teamwork and complementary skill sets in fostering innovation.

2. Yung-Chang Lin:

Another significant collaboration for Kuo was with Yung-Chang Lin. Together, they embarked on projects that resulted in transformative inventions. Their partnership demonstrates the value of multidisciplinary approaches, combining expertise from diverse domains for groundbreaking outcomes.

Conclusion:

Chien-Li Kuo's outstanding contributions and innovative mindset have left an indelible mark on various industries. His patented inventions, including the semiconductor device package with metal thermal interface material and the low warpage high-density trench capacitor, highlight his technical prowess and ability to address pressing challenges. Collaborating with peers, such as Sun-Chieh Chien and Yung-Chang Lin, Kuo has played a vital role in advancing technology, electronics, and manufacturing. With a career defined by achievements, Kuo continues to inspire aspiring inventors and shape the trajectory of innovation in the years to come.

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