The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2024
Filed:
Aug. 24, 2021
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Jheng-Sheng You, Hsinchu County, TW;
Hsin-Chih Lin, Hsinchu, TW;
Kun-Ming Huang, Taipei, TW;
Lieh-Chuan Chen, Hsinchu, TW;
Po-Tao Chu, New Taipei, TW;
Shen-Ping Wang, Keelung, TW;
Chien-Li Kuo, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Abstract
A device includes a first III-V compound layer, a second III-V compound layer, a dielectric layer, a contact, a metal-containing layer, and a metal contact. The second III-V compound layer is over the first III-V compound layer. The dielectric layer is over the second III-V compound layer. The contact extends through the dielectric layer to the second III-V compound layer. The contact is in contact with a top surface of the dielectric layer and an inner sidewall of the dielectric layer. The metal-containing layer is over and in contact with the contact, and a portion of the metal-containing layer is directly above the dielectric layer. The metal contact is over and in contact with the metal-containing layer.