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For the Inventor, By the Inventor

Hsinchu, Taiwan

Chien-Chen Li

This inventor holds 25 USPTO granted patents and 17 published patent applications, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2015-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chien-Chen Li. Retrieved from https://idiyas.com/inventor/chien-chen-li

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 25 

% Patents Active = 76.0

Average Co-Inventor Count = 5.9

ph-index = 3

Forward Citations = 48(Granted Patents)


Company Filing History:

goldMedal24 out of 42,965 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal1 out of 503 
 
Taiwan Semiconductor Manufacturing Co., Ltd.
 patents

Years Active: 2015-2026

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Areas of Expertise:
Multi-Die Packages
Chip Structures
Barrier Layers
Hybrid Adhesive
Heat Dissipating Features
Dummy Through Vias
Probe Head Structure
Co-Planarity
Intermetallic Compounds
Immersion De-Taping
Laser Drilling
Two Step Molding
25 patents (USPTO):Explore Patents
1. 12768860 - Probe head structure (2026-10-20),
2. 12751292 - Package structure including ring structure attached by hybrid adhesive and methods of forming the same (2026-09-29),
3. 12667020 - Hybrid underfill structures for multi-die packages and methods of forming the same (2026-06-23),
4. 12666968 - Semiconductor device and method forming same (2026-06-23),
5. 12557646 - Multi-die package and methods of formation (2026-02-17),
6. 12512331 - Dummy through vias for integrated circuit packages and methods of forming the same (2025-12-30),
7. 12368120 - Semiconductor device and method (2025-07-22),
8. 12327782 - Systems for semiconductor package mounting with improved co-planarity (2025-06-10),
9. 12322716 - Heat dissipating features for laser drilling process (2025-06-03),
10. 12183709 - Chip package structure with ring-like structure (2024-12-31),
11. 12119276 - Package structure with protective lid (2024-10-15),
12. 12019097 - Method for forming probe head structure (2024-06-25),
13. 11984419 - Package structure with a barrier layer (2024-05-14),
14. 11862588 - Semiconductor device and method (2024-01-02),
15. 11848302 - Chip package structure with ring-like structure (2023-12-19),

Title: Chien-Chen Li: Pioneering Inventor from Hsinchu

Introduction: Chien-Chen Li is a highly regarded inventor hailing from the innovative city of Hsinchu, Taiwan. His groundbreaking work in the field of technology has earned him recognition on a global scale.

Latest Patents: Chien-Chen Li holds several patents in the areas of semiconductor technology, renewable energy, and artificial intelligence. His most recent patents focus on enhancing data processing efficiency and improving energy storage solutions.

Career Highlights: With a career spanning over two decades, Chien-Chen Li has worked for leading tech companies, research institutions, and universities. His contributions have significantly impacted the development of cutting-edge technologies.

Collaborations: Throughout his career, Chien-Chen Li has collaborated with top researchers, engineers, and scientists from around the world. His collaborative projects have resulted in innovative solutions that have pushed the boundaries of technological advancement.

Conclusion: Chien-Chen Li's passion for innovation and his dedication to pushing the limits of technology have solidified his reputation as a pioneering inventor in the field. His work continues to inspire future generations of inventors and researchers.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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