The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2026

Filed:

May. 21, 2024
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Wen-Yi Lin, New Taipei City, TW;

Hao Chen, New Taipei City, TW;

Chuan-Hsiang Sun, Taoyuan City, TW;

Mill-Jer Wang, Hsinchu, TW;

Chien-Chen Li, Hsinchu, TW;

Chen-Shien Chen, Zhubei City, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); G01R 1/067 (2006.01);
U.S. Cl.
CPC ...
G01R 1/06761 (2013.01); G01R 1/06733 (2013.01); G01R 1/06794 (2013.01); G01R 31/2851 (2013.01);
Abstract

A probe head structure is provided. The probe head structure includes a flexible substrate having a top surface and a bottom surface. The probe head structure includes a first probe pillar passing through the flexible substrate. The probe head structure includes a redistribution structure on the top surface of the flexible substrate and the first probe pillar. The probe head structure includes a wiring substrate over the redistribution structure. The probe head structure includes a first conductive bump connected between the wiring substrate and the redistribution structure.


Find Patent Forward Citations

Lin, Wen-Yi. (2026). Probe head structure (U.S. Patent No. 12768860). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12768860

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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