IDiyas

For the Inventor, By the Inventor

Taipei, Taiwan

Wen-Yi Lin

USPTO Granted Patents = 31 


Average Co-Inventor Count = 3.6

ph-index = 6

Forward Citations = 161(Granted Patents)


Location History:

  • Wugu Township, TW (2012 - 2015)
  • Taipei, TW (2018)
  • Tainan, TW (2018 - 2019)
  • New Taipei, TW (2013 - 2024)

Company Filing History:

goldMedal28 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal3 out of 4,763 
 
Mediatek Corporation
 patents

Years Active: 2012-2025

where 'Filed Patents' based on already Granted Patents

31 patents (USPTO):
1. 12490453 - Heterostructure channel layer for semiconductor devices (2025-12-02),
2. 12327782 - Systems for semiconductor package mounting with improved co-planarity (2025-06-10),
3. 12278156 - Semiconductor package (2025-04-14),
4. 12119276 - Package structure with protective lid (2024-10-15),
5. 12019097 - Method for forming probe head structure (2024-06-25),
6. 11862528 - Method for forming semiconductor package (2024-01-02),
7. 11764118 - Structure and formation method of chip package with protective lid (2023-09-19),
8. 11011447 - Semiconductor package and method for forming the same (2021-05-18),
9. 10790164 - Method for forming package structure (2020-09-29),
10. 10361190 - Standard cell circuitries (2019-07-23),
11. 10305480 - Voltage generating circuit and ESD protecting method (2019-05-28),
12. 10269602 - Wafer warpage inspection system and method using the same (2019-04-23),
13. 10126363 - Flip-flop circuit and scan chain using the same (2018-11-13),
14. 9887144 - Ring structure for chip packaging (2018-02-06),
15. 9881908 - Integrated fan-out package on package structure and methods of forming same (2018-01-30),

Title: **Innovative Contributions of Wen-Yi Lin in New Taipei, Taiwan**

Introduction

Wen-Yi Lin is a prominent inventor based in New Taipei, Taiwan, known for his remarkable contributions to technology and innovation. With a total of 25 patents, Lin has made significant strides in the field of semiconductor packaging and design.

Latest Patents

Among his latest patents are two notable innovations:

1. **Package Structure with Protective Lid**

This invention pertains to a package structure designed with a substrate and a chip-containing structure placed atop it. One of the key features of this package is the protective lid, which is attached through two adhesive elements with differing electrical resistivities. The strategic placement of these elements enhances the functionality and protective capacity of the package.

2. **Method for Forming Probe Head Structure**

This patent involves the development of a probe head structure that consists of a flexible substrate. The highlight of this invention is the first probe pillar that passes through the flexible substrate, which includes a redistribution structure that integrates a dielectric and wiring structure. The layered approach in this design optimizes electrical connections and performance.

Career Highlights

Wen-Yi Lin works at Taiwan Semiconductor Manufacturing Company Limited, where he has played a key role in advancing semiconductor technologies. His innovative patents reflect his expertise and commitment to improving product efficiency and reliability.

Collaborations

Throughout his career, Lin has collaborated with talented coworkers, including Po-Yao Lin and Ming-Chih Yew. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and innovation in their projects.

Conclusion

Wen-Yi Lin's contributions to the field of semiconductors not only showcase his inventive capability but also highlight the importance of collaboration in innovation. As technology continues to evolve, Lin's patents serve as a foundation for future advancements in packaging and probe head structures.

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