The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2024
Filed:
May. 14, 2021
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Chin-Hua Wang, New Taipei, TW;
Po-Yao Lin, Zhudong Township, Hsinchu County, TW;
Feng-Cheng Hsu, New Taipei, TW;
Shin-Puu Jeng, Hsinchu, TW;
Wen-Yi Lin, New Taipei, TW;
Shu-Shen Yeh, Taoyuan, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A method of forming a semiconductor package is provided. The method includes mounting a chip on a package substrate. The method further includes placing a heat spreader over the chip and applying a thermal interface material to a first surface of the heat spreader facing the chip. The heat spreader is flexible. In addition, the method includes attaching the heat spreader to the chip through the thermal interface material by rolling a rod over a second surface of the heat spreader, and the second surface is opposite to the first surface.