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For the Inventor, By the Inventor

Hsinchu, Taiwan

Yi-Che Chiang

This inventor holds 17 USPTO granted patents and 5 published patent applications. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2019-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yi-Che Chiang. Retrieved from https://idiyas.com/inventor/yi-che-chiang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 17 

% Patents Active = 82.4

Average Co-Inventor Count = 4.8

ph-index = 2

Forward Citations = 16(Granted Patents)


Company Filing History:

goldMedal16 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal1 out of 481 
 
Taiwan Semiconductor Manufacturing Co., Ltd.
 patents

Years Active: 2019-2026

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17 patents (USPTO):Explore Patents
1. 12751292 - Package structure including ring structure attached by hybrid adhesive and methods of forming the same (2026-09-29),
2. 12604734 - Integrated circuit packages and methods (2026-04-14),
3. 12599018 - Package structure with enhancement structure and manufacturing method thereof (2026-04-07),
4. 12557661 - Package structure with antenna element (2026-02-17),
5. 12406941 - Dielectric slots underneath conductive vias in interconnect structure of semiconductor package and method of forming the same (2025-09-02),
6. 12362275 - Method of fabricating package structure including a plurality of antenna patterns (2025-07-15),
7. 12021024 - Semiconductor device including a semiconductor die and a plurality of antenna patterns (2024-06-25),
8. 11705411 - Chip package with antenna element (2023-07-18),
9. 11532576 - Semiconductor package and manufacturing method thereof (2022-12-20),
10. 11444023 - Semiconductor device, package structure including a heat dissipation element having a conductive base and a plurality of antenna patterns and method of fabricating the semiconductor device (2022-09-13),
11. 11373922 - Semiconductor packages having thermal through vias (TTV) (2022-06-28),
12. 11018113 - Memory module, semiconductor package including the same, and manufacturing method thereof (2021-05-25),
13. 11004809 - Chip package with antenna element (2021-05-11),
14. 10937719 - Package structure and method of fabricating the same (2021-03-02),
15. 10818588 - Semiconductor device, package structure and method of fabricating the same (2020-10-27),

Title: Yi-Che Chiang: Innovator in Semiconductor Packaging Technology

Introduction

Yi-Che Chiang is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 13 patents. His work focuses on innovative methods that enhance the performance and efficiency of semiconductor devices.

Latest Patents

Among his latest patents is a method for creating dielectric slots underneath conductive vias in interconnect structures of semiconductor packages. This method involves depositing a first dielectric layer over a carrier substrate, forming a metallization pattern, and creating a dielectric slot that is laterally positioned under a through via. Another notable patent details a package structure that includes a semiconductor die, insulating encapsulant, and multiple redistribution layers, which are designed to improve heat dissipation and electrical connectivity.

Career Highlights

Yi-Che Chiang is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His expertise in semiconductor packaging has positioned him as a key player in the development of advanced technologies that drive innovation in this field.

Collaborations

He has collaborated with notable colleagues such as Hsin-Yu Pan and Sen-Kuei Hsu, contributing to various projects that aim to push the boundaries of semiconductor technology.

Conclusion

Yi-Che Chiang's work in semiconductor packaging exemplifies the innovative spirit of modern technology. His patents and contributions continue to influence the industry, paving the way for future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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