IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10937719 B1

PDFFull Text
Date of Patent:
Mar. 02, 2021

Filed:

Jun. 30, 2017

Package structure and method of fabricating the same

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Yung-Ping Chiang, Hsinchu County, TW;

Chao-Wen Shih, Hsinchu County, TW;

Min-Chien Hsiao, Taichung, TW;

Nien-Fang Wu, Chiayi, TW;

Shou-Zen Chang, Hsinchu, TW;

Yi-Che Chiang, Hsinchu, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Attorney:

JCIPRNET

Primary Examiner:

Graham P Smith

Assistant Examiner:

Jae K Kim

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/66 (2006.01); H01L 25/16 (2006.01); H01P 1/30 (2006.01); H01P 3/02 (2006.01); H01L 23/31 (2006.01); H01L 23/433 (2006.01); H01Q 21/06 (2006.01); H01L 21/56 (2006.01); H01Q 15/00 (2006.01); H01Q 1/22 (2006.01); H01L 21/683 (2006.01); H01P 1/20 (2006.01); H01L 23/538 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49548 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/3107 (2013.01); H01L 23/4334 (2013.01); H01L 23/49575 (2013.01); H01L 23/5389 (2013.01); H01L 23/66 (2013.01); H01L 25/162 (2013.01); H01L 25/165 (2013.01); H01P 1/2005 (2013.01); H01P 1/30 (2013.01); H01P 3/026 (2013.01); H01Q 1/2283 (2013.01); H01Q 15/0086 (2013.01); H01Q 21/062 (2013.01); H01L 23/49838 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68372 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/18 (2013.01);
Abstract

A package structure comprising a die, a first molding compound encapsulating the die, an antenna structure and a reflector pattern disposed above the die is provided. Through vias penetrating through the first molding compound are disposed around the die. The reflector pattern is disposed on the die and the through vias. The antenna structure is disposed on the reflector pattern and electrically connected with the reflector pattern and the die. The antenna structure is wrapped by a second molding compound disposed on the reflector pattern.

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