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For the Inventor, By the Inventor

Chiayi, Taiwan

Nien-Fang Wu

This inventor holds 29 USPTO granted patents and 11 published patent applications, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2016-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Nien-Fang Wu. Retrieved from https://idiyas.com/inventor/nien-fang-wu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 29 

% Patents Active = 100.0

Average Co-Inventor Count = 5.3

ph-index = 3

Forward Citations = 46(Granted Patents)


Company Filing History:

goldMedal28 out of 42,965 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal1 out of 503 
 
Taiwan Semiconductor Manufacturing Co., Ltd.
 patents

Years Active: 2016-2026

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Areas of Expertise:
Silicon-Based Optical Component
Semiconductor Device Structure
Integrated Circuit Packages
Programmable Inductor
Chip Package
Antenna Element
Die Stack Structure
Manufacturing Method
Guard Ring Structure
Package Structure
Semiconductor Devices
29 patents (USPTO):Explore Patents
1. 12748271 - Silicon-based optical component and method of forming the same (2026-09-29),
2. 12699234 - Package devices and methods of manufacture (2026-08-04),
3. 12610854 - Semiconductor device structure with bonding pad and method for forming the same (2026-04-21),
4. 12564108 - Package structure and method of fabricating the same (2026-02-24),
5. 12557661 - Package structure with antenna element (2026-02-17),
6. 12412862 - Package structure and manufacturing method thereof (2025-09-09),
7. 12355008 - Methods of fabricating package structure (2025-07-08),
8. 12288752 - Semiconductor packages (2025-04-29),
9. 12243681 - Programmable inductor and methods of manufacture (2025-03-04),
10. 12119328 - Methods of fabricating the same die stack structure and semiconductor structure (2024-10-15),
11. 12057439 - Integrated circuit packages (2024-08-06),
12. 12015013 - Die stack structure, semiconductor structure and method of fabricating the same (2024-06-18),
13. 11810897 - Package structure and method of fabricating the same (2023-11-07),
14. 11756731 - Programmable inductor (2023-09-12),
15. 11742297 - Semiconductor packages (2023-08-29),

Title: The Innovative Journey of Inventor Nien-Fang Wu

Introduction:

Nien-Fang Wu, a talented inventor hailing from Chiayi, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents:

Wu's latest patents include cutting-edge technologies in the realm of artificial intelligence, renewable energy, and sustainable agriculture, showcasing his versatility and forward-thinking approach.

Career Highlights:

Throughout his illustrious career, Nien-Fang Wu has been recognized for his exceptional problem-solving skills and ability to transform complex ideas into practical solutions. His inventions have revolutionized various industries, earning him a reputation as a visionary inventor.

Collaborations:

Wu has collaborated with leading research institutions and tech companies worldwide to further develop his inventions and bring them to the market. His partnerships have been instrumental in pushing the boundaries of innovation and driving positive change.

Conclusion:

Inventor Nien-Fang Wu's relentless pursuit of innovation and passion for creating a better future through technology continue to inspire the next generation of inventors and entrepreneurs. His impact on the world of inventions is truly remarkable.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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