The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2025
Filed:
Jul. 05, 2023
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Ming-Fa Chen, Taichung, TW;
Nien-Fang Wu, Chiayi, TW;
Sung-Feng Yeh, Taipei, TW;
Tzuan-Horng Liu, Taoyuan, TW;
Chao-Wen Shih, Hsinchu County, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2005.12); H01L 21/48 (2005.12); H01L 21/56 (2005.12); H01L 23/00 (2005.12); H01L 23/31 (2005.12); H01L 25/00 (2005.12); H01L 25/065 (2022.12);
U.S. Cl.
CPC ...
H01L 23/5389 (2012.12); H01L 21/4853 (2012.12); H01L 21/4857 (2012.12); H01L 21/565 (2012.12); H01L 23/3128 (2012.12); H01L 23/5383 (2012.12); H01L 23/5386 (2012.12); H01L 24/19 (2012.12); H01L 24/20 (2012.12); H01L 25/0652 (2012.12); H01L 25/0655 (2012.12); H01L 25/0657 (2012.12); H01L 25/50 (2012.12); H01L 2224/214 (2012.12); H01L 2225/06524 (2012.12); H01L 2225/06548 (2012.12); H01L 2225/06562 (2012.12); H01L 2225/06586 (2012.12); H01L 2924/19041 (2012.12); H01L 2924/19105 (2012.12);
Abstract
A semiconductor package includes a first die and a through via. The through via is electrically connected to the first die. The through via includes a first conductive layer having a first width, a second conductive layer having a second width different from the first width and a first seed layer disposed aside an interface between the first conductive layer and the second conductive layer.