logo

For the Inventor, By the Inventor

Longtan, Taiwan

Tzuan-Horng Liu

This inventor holds 117 USPTO granted patents and 56 published patent applications, primarily in Semiconductor Packaging (CPC class H01L25-50). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2012-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tzuan-Horng Liu. Retrieved from https://idiyas.com/inventor/tzuan-horng-liu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 117 

% Patents Active = 96.6

Average Co-Inventor Count = 4.1

ph-index = 9

Forward Citations = 355(Granted Patents)

Forward Citations (Not Self Cited) = 274(Dec 10, 2025)


Inventors with similar research interests:

🔬 See more inventors

Location History:

  • Logtan Township, TW (2012)
  • Fongtan Township, TW (2020)
  • Longtan Township, TW (2012 - 2024)
  • Taoyuan County, TW (2019 - 2024)
  • Taoyuan, TW (2019 - 2024)

Company Filing History:

goldMedal114 out of 42,926 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal3 out of 491 
 
Taiwan Semiconductor Manufacturing Co., Ltd.
 patents

Years Active: 2012-2026

Loading Chart...
Areas of Expertise:
Semiconductor Device
Package Structure
Manufacturing Method
Integrated Circuit
Die Stack Structure
3D Stacking
Chip Integration
Thermal Management
Through Substrate Via
Bonding Layers
Device Fabrication
117 patents (USPTO):Explore Patents
1. 12772882 - Semiconductor structure and method of making same (2026-10-20),
2. 12757764 - Semiconductor package and manufacturing method thereof (2026-10-06),
3. 12757706 - Package structure and manufacturing method thereof (2026-10-06),
4. 12696741 - Semiconductor device and method (2026-07-28),
5. 12660696 - Integrated circuit packages and methods of forming the same (2026-06-16),
6. 12642149 - Package formation using UBM-first approach and the corresponding packages (2026-05-26),
7. 12610834 - Semiconductor device package structure and manufacturing method thereof (2026-04-21),
8. 12575465 - Semiconductor package and manufacturing method thereof (2026-03-10),
9. 12568827 - Method for fabricating device die (2026-03-03),
10. 12566302 - Package structure and method of forming the same (2026-03-03),
11. 12564108 - Package structure and method of fabricating the same (2026-02-24),
12. 12538814 - Semiconductor structure with a bridge embedded therein and method manufacturing the same (2026-01-27),
13. 12506099 - Semiconductor package and manufacturing method thereof (2025-12-23),
14. 12489077 - Semiconductor structure and method manufacturing the same (2025-12-02),
15. 12469753 - Integrated circuit component and package structure having the same (2025-11-11),

Title: Tzuan-Horng Liu: A Visionary Inventor Shaping the Future of Technology

Introduction:

Tzuan-Horng Liu, a visionary inventor from Taoyuan, Taiwan, is known for his passion for innovation that is driving positive change in society. With six patents to his name, Liu has established himself as a prominent figure in the world of technology and invention.

Latest Patents:

Among his latest patents is a cutting-edge die stack structure and manufacturing method that revolutionizes the way semiconductor chips are stacked and interconnected. Another innovative creation is a chip structure and fabrication method that enhances the performance and efficiency of semiconductor chips.

Career Highlights:

Liu is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading semiconductor company in Taiwan. His contributions to the company's research and development efforts have been instrumental in driving technological advancements in the industry.

Collaborations:

Throughout his career, Liu has collaborated with talented individuals such as Ming-Fa Chen and Sung-Feng Yeh. Together, they have worked on groundbreaking projects that have pushed the boundaries of innovation and technology.

Conclusion:

Tzuan-Horng Liu's relentless pursuit of innovation, coupled with his dedication to creating a positive impact on society, has solidified his position as a visionary inventor shaping the future of technology. His pioneering work in the field of semiconductor technology is paving the way for new possibilities and advancements in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…