Package formation using ubm-first approach and the corresponding packages

Abstract

A method includes forming a reconstructed wafer including forming an Under-Bump Metallurgy (UBM) over a first carrier, forming a first interconnect structure including a plurality of redistribution lines over and electrically connecting to the UBM, bonding a first die over the first interconnect structure, encapsulating the first die in a first encapsulant, forming a second interconnect structure over the first die, and bonding a second die over the second interconnect structure. The method further includes de-bonding the reconstructed wafer from the first carrier, forming an electrical connector physically contacting the UBM, sawing the reconstructed wafer to form a plurality of packages, and bonding one of the plurality of packages to a package component.