The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2026
Filed:
Aug. 16, 2022
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Tzuan-Horng Liu, Taoyuan City, TW;
Hao-Yi Tsai, Hsinchu City, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
A semiconductor package and a manufacturing method are provided. The semiconductor package includes a semiconductor die laterally covered by an insulating encapsulation, a first redistribution structure overlying the insulating encapsulation and a back surface of the semiconductor die, a second redistribution structure underlying the insulating encapsulation and an active surface of the semiconductor die opposite to the back surface, active through insulating vias (TIVs) penetrating through the insulating encapsulation, and dummy features. The semiconductor die is electrically coupled to the first redistribution structure through the second redistribution structure and the active TIVs. Each of the dummy features includes a dummy TIV laterally covered by the insulating encapsulation, the dummy TIVs are disposed along package edges in a top view, and the dummy features are electrically floating.