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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12557661 B1

PDFFull Text
Date of Patent:
Feb. 17, 2026

Filed:

Jun. 05, 2023

Package structure with antenna element

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Yung-Ping Chiang, Zhubei, TW;

Yi-Che Chiang, Hsinchu, TW;

Nien-Fang Wu, Chiayi, TW;

Min-Chien Hsiao, Taichung, TW;

Chao-Wen Shih, Zhubei, TW;

Shou-Zen Chang, Hsinchu, TW;

Chung-Shi Liu, Hsinchu, TW;

Chen-Hua Yu, Hsinchu, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Bryan R Junge

Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/552 (2006.01); H01L 25/065 (2023.01); H01Q 9/04 (2006.01); H01Q 21/00 (2006.01); H01Q 21/06 (2006.01); H01L 21/56 (2006.01); H01L 23/538 (2006.01); H01Q 1/22 (2006.01); H01Q 21/22 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 21/6835 (2013.01); H01L 23/3121 (2013.01); H01L 23/552 (2013.01); H01L 24/02 (2013.01); H01L 24/13 (2013.01); H01L 24/19 (2013.01); H01L 24/24 (2013.01); H01L 24/25 (2013.01); H01L 24/32 (2013.01); H01L 25/0655 (2013.01); H01Q 9/045 (2013.01); H01Q 21/0087 (2013.01); H01Q 21/065 (2013.01); H01L 21/568 (2013.01); H01L 21/6836 (2013.01); H01L 23/3128 (2013.01); H01L 23/5389 (2013.01); H01L 2221/68331 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68372 (2013.01); H01L 2223/6644 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/02371 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/24265 (2013.01); H01L 2224/25171 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/92244 (2013.01); H01L 2224/97 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19104 (2013.01); H01L 2924/3025 (2013.01); H01Q 1/2283 (2013.01); H01Q 21/0075 (2013.01); H01Q 21/22 (2013.01);
Abstract

A package structure is provided. The package structure includes a dielectric structure and an antenna structure disposed in the dielectric structure. The package structure also includes a semiconductor device disposed on the dielectric structure and a protective layer surrounding the semiconductor device. The package structure further includes a conductive feature electrically connecting the semiconductor device and the antenna structure. A portion of the antenna structure is between the conductive feature and the dielectric structure.

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