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For the Inventor, By the Inventor

Hsinchu, Taiwan

Shou-Zen Chang

USPTO Granted Patents = 69 

 

Average Co-Inventor Count = 4.3

ph-index = 7

Forward Citations = 345(Granted Patents)


Inventors with similar research interests:


Location History:

  • Tervuren, BE (2010)
  • Hsinchu Country, TW (2011 - 2013)
  • Panchiao, TW (2006 - 2019)
  • New Taipei, TW (2017 - 2023)
  • Hsin-Chu, TW (2000 - 2024)
  • Taichung, TW (2022 - 2024)

Company Filing History:

goldMedal51 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal17 out of 167 
 
Powerchip Semiconductor Manufacturing Corporation
 patents
bronzeMedal5 out of 557 
 
Imec
 patents
4. 2 out of 131,214 
 
Samsung Electronics Co., Ltd.
 patents
5. 1 out of 832,680 
Other
 patents
where one patent can have more than one assignee

Years Active: 2000-2025

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69 patents (USPTO):
1. 12414304 - 3D monolithic stacking memory structure with oxide-semiconductor field effect transistor and ferroelectric metal-insulator-metal storage capacitor (2025-09-09),
2. 12394686 - Semiconductor structure and manufacturing method thereof (2025-08-19),
3. 12389613 - Semiconductor structure (2025-08-12),
4. 12354921 - Wafer structure including probe marked test pads (2025-07-08),
5. 12354870 - Multilayer stacking wafer bonding structure and method of manufacturing the same (2025-07-08),
6. 12327777 - Semiconductor package structure and manufacturing method thereof (2025-06-10),
7. 12266847 - Semiconductor packages and manufacturing methods thereof (2025-04-01),
8. 12101941 - Ferroelectric memory structure (2024-09-24),
9. 12009575 - Package structure (2024-06-11),
10. 11967558 - Wafer stacking structure and manufacturing method thereof (2024-04-23),
11. 11917804 - Manufacturing method of SRAM device (2024-02-27),
12. 11855333 - Semiconductor packages and manufacturing methods thereof (2023-12-26),
13. 11837564 - Semiconductor bonding structure (2023-12-05),
14. 11800721 - Ferroelectric memory structure with different ferroelectric capacitors (2023-10-24),
15. 11749648 - Circuit structure for testing through silicon vias in three-dimensional integrated circuit (2023-09-05),

Title: The Innovative Journey of Inventor Shou-Zen Chang

Introduction: Shou-Zen Chang, a pioneering inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Shou-Zen Chang's latest patents focus on advancements in semiconductor technology, particularly in the development of next-generation microchips with enhanced performance and efficiency.

Career Highlights: Throughout his illustrious career, Shou-Zen Chang has been instrumental in revolutionizing the semiconductor industry with his cutting-edge inventions. His work has not only pushed the boundaries of technology but has also paved the way for future innovations in the field.

Collaborations: Shou-Zen Chang has collaborated with leading tech companies and research institutions around the world to further his research and bring his inventions to life. His collaborative efforts have resulted in the successful implementation of his groundbreaking ideas in real-world applications.

Conclusion: In conclusion, Shou-Zen Chang's relentless pursuit of innovation and his passion for pushing the limits of technology have solidified his position as a trailblazing inventor in the field of semiconductor technology. His contributions continue to inspire the next generation of inventors and shape the future of technological advancements.

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