Shou-Zen Chang

This inventor holds 73 USPTO granted patents and 17 published patent applications and 2 EPO patents, primarily in Semiconductor Packaging (CPC class H01L). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Powerchip Semiconductor Manufacturing Corporation, Imec Vzw. Active years: 2000-2026.

USPTO Granted Patents = 73 (Patent Applications = 17)

% Patents Active = 93.2

EPO Patents = 2 (Patent Applications = 1)

Average Co-Inventor Count = 4.3

ph-index = 7

Forward Citations = 353(Granted Patents)

Forward Citations (Not Self Cited) = 330(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Tervuren, BE (2010)
Hsinchu Country, TW (2011 - 2013)
Panchiao, TW (2006 - 2019)
New Taipei, TW (2017 - 2023)
Hsin-Chu, TW (2000 - 2024)
Taichung, TW (2022 - 2024)

Company Filing History:

52 out of 42,759

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

20 out of 190

Powerchip Semiconductor Manufacturing Corporation

Samsung Electronics Co., Ltd.

patents

5. 1 out of 834,411

Other

patents

where one patent can have more than one assignee

Years Active: 2000-2026

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Areas of Expertise:

CMOS Image Sensor

3D Monolithic Stacking

FinFET Structures

Ferroelectric Memory

Wafer Bonding

Antenna Element

Semiconductor Structure

SRAM Device

Package Structure

Oxide Semiconductor

Multilayer Stacking

Through Silicon Vias

73 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12598824 - CMOS image sensor with 3D monolithic OSFET and FEMIM (2026-04-07),

2. 12575403 - Interconnect structure (2026-03-10),

3. 12568819 - Semiconductor structure (2026-03-03),

4. 12557661 - Package structure with antenna element (2026-02-17),

5. 12414304 - 3D monolithic stacking memory structure with oxide-semiconductor field effect transistor and ferroelectric metal-insulator-metal storage capacitor (2025-09-09),

6. 12394686 - Semiconductor structure and manufacturing method thereof (2025-08-19),

7. 12389613 - Semiconductor structure (2025-08-12),

8. 12354921 - Wafer structure including probe marked test pads (2025-07-08),

9. 12354870 - Multilayer stacking wafer bonding structure and method of manufacturing the same (2025-07-08),

10. 12327777 - Semiconductor package structure and manufacturing method thereof (2025-06-10),

11. 12266847 - Semiconductor packages and manufacturing methods thereof (2025-04-01),

12. 12101941 - Ferroelectric memory structure (2024-09-24),

13. 12009575 - Package structure (2024-06-11),

14. 11967558 - Wafer stacking structure and manufacturing method thereof (2024-04-23),

15. 11917804 - Manufacturing method of SRAM device (2024-02-27),

Title: The Innovative Journey of Inventor Shou-Zen Chang

Introduction: Shou-Zen Chang, a pioneering inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Shou-Zen Chang's latest patents focus on advancements in semiconductor technology, particularly in the development of next-generation microchips with enhanced performance and efficiency.

Career Highlights: Throughout his illustrious career, Shou-Zen Chang has been instrumental in revolutionizing the semiconductor industry with his cutting-edge inventions. His work has not only pushed the boundaries of technology but has also paved the way for future innovations in the field.

Collaborations: Shou-Zen Chang has collaborated with leading tech companies and research institutions around the world to further his research and bring his inventions to life. His collaborative efforts have resulted in the successful implementation of his groundbreaking ideas in real-world applications.

Conclusion: In conclusion, Shou-Zen Chang's relentless pursuit of innovation and his passion for pushing the limits of technology have solidified his position as a trailblazing inventor in the field of semiconductor technology. His contributions continue to inspire the next generation of inventors and shape the future of technological advancements.